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Standalone 6DoF HMD Details Revealed

Standalone 6DoF HMD Details Revealed

At a press conference held in their global headquarters in Beijing, Pico officially revealed the Pico Neo as the world's first mass-produced standalone VR device with six degrees of freedom (6DoF) for both head and controllers.

The Pico Neo is Pico’s latest generation of standalone VR headset. It features the Qualcomm Snapdragon 835 Mobile VR Platform, adopts all-in-one ID design, uses lighter and more breathable cloth material, and is equipped with 3K high definition display, high-speed 4GB RAM, 64GB UFS2.0 ROM, supporting 256 GB expanded storage.

Featuring a new ultrasonic remote controller solution, the Pico Neo enables 6DoF head-and-controller tracking and positioning functions without any external sensors. Pico claims it is the world's first VR standalone device that actualises 6DoF head-and-controller tracking at a mass production scale.

The Pico Neo is available for pre-order in the US and EU for qualified business customers and developers for $749.00. Pre-order at www.pico-neo.com

 

B2B VR Enterprise Solutions Program

Although the company has been focusing on the Consumer market, it never stopped exploring applications within B2B industries. Pico established the Enterprise Program at the end of 2015 and after more than two years of R&D experience and exploration, the company has developed several industry application solutions-based on Pico’s full line of hardware products. These include:

  • The E – PUI (Product User Interface) VR education broadcast control system
  • VR theatre broadcast control system
  • Spatial orientation and motion capture
  • Depth perception systems
  • An upgraded scheme of family VR entertainment systems

Combined with industry VR content, Pico can provide industry clients with customised hardware, content, software, and overall system solutions. In 2017, Pico's B2B projects have reached over 200 businesses including Toyota and Volkswagen.

 

Pico Zense’s Debut – New Exploration In Depth Vision

Pico also launched a new set of Pico Zense TOF depth sensor solutions - the DCAM100 and DCAM710 - as its core hardware products. The two camera modules are based on TOF technology and feature small form factors, economic power consumption, clear imaging, VGA standardized precision, and can be used in the range width from 0.2 meters to 8 meters.

Pico Zense’s hardware modules, the DCAM100 and DCAM710, are available for pre-order in the US and EU for qualified business customers and developers for $299.00. Pre-order at www.pico-interactive.com/zense

 

Pico will be attending CES 2018 to showcase the Pico Goblin, Pico Neo and the Pico Zense DCAM100 and DCAM710. To learn more, please visit the Pico booth at the Las Vegas Convention Center in South Hall 1, Tech East Zone at Booth number 21718.


Editor

Steve is an award-winning editor and copywriter with 20 years’ experience specialising in consumer technology and video games. He was part of a BAFTA nominated developer studio as project manager for the UK’s first fully interactive digital TV channel. In addition to editing TheVirtualReport.biz, Steve contributes to PocketGamer.biz, PCGamesInsider.biz and BlockchainGamer.biz, as well as creating marketing content for a range of SMEs and agencies.

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